TS-300S Hesper
HDPCVD equipment
Product Introduction
Hesper products are HDPCVD (High Density Plasma Chemical Vapor Deposition) 12 inch high-performance thin film deposition equipment. This device is mainly used for STI, PMD, ILD, andIMD and other channel media fillers are widely used in logic chip and memory chip manufacturing processes. The Hesper series products adopt the TS-300S hexagonal platform, which can be paired with 5 reaction chambers. They have advantages such as high production capacity, high filling effect, and low particle size, and can meet various technical node requirements in the chip process.
