At the end of September 2018, the 12inch atomic layer deposition (ALD) equipment independently developed by Piotech passed the customer's acceptance.
ALD equipment is a key thin-film deposition equipment in IC fabrication process, which is regarded as one of the most important links in the development and manufacturing of advanced semiconductor devices. Based on the proven high-capacity PECVD equipment platform, Piotech has successfully developed the first mass-produced 12 inch ALD equipment in China. This systems can be used for manufacturing ULSI devices of below 28nm and above, as well as in the fields of OLED and advanced TSV packaging. The customer used this equipment to deposit SiO2, SiNx and other insulating films in its advanced production line. The equipment has successfully entered the trial production line for examination and verification, which lasted more than three months, and passed the tests and received customer’s acceptance. All performance indexes of the equipment met the requirements, and reached or exceeded the advanced levels of similar products on the market. This is another major breakthrough for Piotech in the process of developing and delivering production-worthy semiconductor equipment.
